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Cadence Next-Gen AI-Driven OrCAD X Delivers Up to 5X Faster PCB Design with Cadence OnCloud

09/13/2023 | Cadence Design Systems, Inc.
Cadence Design Systems announced the new Cadence OrCAD X Platform, a cloud-enabled system design solution that offers transformative improvements in ease of use, performance, automation and collaboration.

The Shaughnessy Report: Rigid-flex Design No Longer a Niche

09/12/2023 | Andy Shaughnessy -- Column: The Shaughnessy Report
When I first started covering this industry in 1999, rigid-flex circuits were considered a niche market. In fact, Compaq was deemed a trendsetter for using rigid-flex in its laptops. Now, analysts at Credence Research predict that the rigid-flex market will top $5 billion by 2026, led in part by the adoption of IoT and the need to connect a variety of smart devices. That’s a pretty big niche. Rigid-flex circuits are everywhere, from servers and smartphones to cameras and pacemakers.

Challenges in Modern PCB Design and Analysis

09/05/2023 | Steve Watt, Zuken
Zuken recognizes the need to address innovation in all areas of the design process while remaining responsive to customer-driven requirements. While we can make predictions about various challenges, concerns, and requirements, our customers play a vital role in shaping the company’s development direction. They have the benefit of being “in the trenches,” so to speak, on a daily basis, so they are the subject matter experts and can help identify gaps in our tools based on where their processes are heading.

Three Ways to Improve High-Speed PCB Signoff, Part 1

09/06/2023 | Brad Griffin, Cadence Design Systems
Signal integrity (SI) and power integrity (PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards, and faster signoff of designs can be achieved by uncovering SI/PI issues early in the design process, before costly respins are required. Three key issues engineers need to overcome to sign off on high-speed PCB designs include power analysis, serializer/deserializer (SerDes) link compliance, and double data rate (DDR) memory interface compliance.

Zuken Unveils CR-8000 2023 with Enhanced Design Efficiency, Analysis for High-Density, High-Speed PCB Designs

08/30/2023 | Zuken
Zuken, a global leader in electronic design automation solutions, announces the availability of CR-8000 2023. The 2023 release is packed with new enhancements covering the entire design process and will empower users and enable them to tackle the challenges of high-density, high-speed PCB designs.
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