It’s Only Common Sense: OCCAM—the Time Is Now
Marcy's Musings: The Growing Industry
Dan’s Biz Bookshelf: Seeing the HowReal Time with… AltiumLive 2020: Event Wrap-Up With Judy Warner
November 5, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Andy Shaughnessy and Judy Warner, director of marketing and community engagement for Altium, discuss the recent virtual AltiumLive events and what the company—and the PCB design community—have learned from the uncertain times of 2020.
Visit Real Time with… AltiumLive 2020 to catch the latest video interviews and event-related content.
Share on:
Suggested Items
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
04/18/2024 | I-Connect007In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.
Now Available: Episode 4, Season 2 of Designing for Reality—Lamination
04/04/2024 | I-Connect007I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.
On the Line With… Talks With Cadence Experts on Changing How PCBs Are Designed and the Role of AI
03/21/2024 | I-Connect007In this second episode, Cadence Distinguished Engineer Taylor Hogan and Product Management Director Patrick Davis discuss the role artificial intelligence and machine learning play in intelligent system design.
Standards Development Propels the Industry Forward
03/20/2024 | Teresa Rowe, IPC Senior Director, Assembly and Standards TechnologyStandards development task groups will meet face-to-face at IPC APEX EXPO, April 6–11. The technical discussions provide an opportunity to share knowledge, learn from other subject matter experts, and network with others who have similar technical interests. You may remember the urgent need for coffee and the possibility of snagging a cookie or a granola bar to maintain the necessary energy level for these marathon sessions.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in